THE MODEL
One platform. Three connected layers.
1
The Platform is what the customer accesses
It brings together RobusTech engineering, reusable assets, IP, qualified flows, and program execution.
2
The Engine is how the customer program is executed
It moves the engagement from definition and architecture to implementation, verification, signoff, and handoff.
3
The Stack is the reusable capability that powers the Engine
It combines architecture, chassis elements, integration assets, IP, qualified flows, and engineering intelligence.
CORE CAPABILITIES
Core capabilities of the Realization Stack
IC Architecture Synthesis
Requirements → structured architecture
Configurable IC/SoC Chassis
Reusable system infrastructure
IP & Integration Library
Lifecycle-managed IP and integration assets
IC Design Intelligence
AI-assisted engineering workflows
Qualified Flows
Design · verification · signoff
PROCESS POSITIONING
Technology-flexible at the platform level. Process-specific in execution.
Process technology
PDK
Toolchain
IP Set
Signoff flow
Program scope
RobusTech uses IC as the technology-neutral umbrella. Each engagement is evaluated and executed against a selected semiconductor process technology, PDK, toolchain, IP set, and signoff flow supported for that program.
OPERATING BOUNDARY
From validated innovation to fabrication handoff
RobusTech may provide
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Requirements and architecture
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Hardware/software partitioning
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Custom RTL and accelerators
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IC and SoC integration
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Verification, DFT, FPGA, and pre-silicon validation
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Physical implementation and signoff
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Tapeout-package preparation and fabrication handoff
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Security and high-assurance engineering
The broader ecosystem provides
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Wafer fabrication and foundry operations
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Semiconductor process and PDK ownership
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Packaging, assembly, production test, and manufacturing unless separately scoped through partners
